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Investigation of thin aluminium films on the rear of monocrystalline silicon solar cells for back surface field formationHARTLEY, O. Nast; RUSSELL, R; HEASMAN, K. C et al.sans titre. 2002, pp 118-121, isbn 0-7803-7471-1, 4 p.Conference Paper

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Bendability of single-crystal Si MOSFETs investigated on flexible substrateLI, H. Y; GUO, L. H; CHENG, C. K et al.IEEE electron device letters. 2006, Vol 27, Num 7, pp 538-541, issn 0741-3106, 4 p.Article

A novel post exposure bake technique to improve CD uniformity over product wafersTAKEISHI, T; HAYASAKI, K; SHIBATA, T et al.SPIE proceedings series. 2005, isbn 0-8194-5733-7, 2Vol, Part 1, 222-229Conference Paper

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Applications for automated wafer backside inspectionTAYLOR, Patrick; PHAM, Thuy; WANG, Charley et al.IEEE / SEMI advanced semiconductor manufacturing conference. 2004, pp 148-152, isbn 0-7803-8312-5, 1Vol, 5 p.Conference Paper

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Impact of semiconductors material on IR laser stimulation signalFIRITI, A; BEAUDOIN, F; HALLER, G et al.Microelectronics and reliability. 2005, Vol 45, Num 9-11, pp 1465-1470, issn 0026-2714, 6 p.Conference Paper

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Dependence of backgating on the type of deep centres in the substrate of GaAs FETsSENGOUGA, Nouredine; ABDESLAM, Noura A.Solid-state electronics. 2008, Vol 52, Num 7, pp 1039-1042, issn 0038-1101, 4 p.Article

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